Hasan Ymeri, B. Nauwelaers, Karen Maex


A simple, efficient CAD-oriented analytic modeling approach to calculate frequency-dependent distributed inductance and associated distributed series resistance per-unit-length of single on-chip interconnects on a lossy silicon substrate is presented. The closed-form formulas for the frequency-dependent series impedance parameters are obtained using vector magnetic potential equation and a complex image technique. The proposed frequency-dependent inductance L(w) and resistance R(w) per-unit-length formulas are shown to be in good agreement with the electromagnetic solutions.

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